AMD is researching photonic technology to transfer data between chips at the speed of light

amd showing interest photonic technology And how will this benefit the company’s multilayer chips. And it is precisely the fact that using photonics, incredibly fast data transfer can be achieved. Actually, we’re talking transfer data between chips at the speed of light,

can be understood as a method of information transfer using photonic technology applied to hardware photons of lightIt uses a transformation with respect to the current transfer form. electronsso we have one too much speed The use of photons and this is a technology that can be very useful for improving the communication between chips. AMD thought of it this way, as it plans to use it to improve data transfer between different chips, to improve consumption, Delay You performanceamong others.

In 2020, AMD already filed a patent for a supercomputer with photonic technology

AMD filed the patent two years ago United States Patent Office Demonstrating the use of this technique. considered one of boss Which could enable photonics-based communications systems integrated on a single chip. However, all this was practically not produced and remained as a written prototype. But it shows AMD’s interest in the technology, and it’s not cheaper, as it will allow for significant improvements in inter-system connectivity. chipotle,

It can be said that photonics started a long time ago 1960spurpose of use light waves to appear tasks similar For those ElectronicsAnd this is that in the case of success we have the advantage that data is transmitted at the speed of light, and in turn we use light as a medium instead of metals In the form copperSo if AMD can use this technology in their chips, Power consumption and latency will be reduced and in addition, if Will increase performance and scalability,

AMD’s patent document was published less than a month ago last June 30. After using it 2 years after its introduction, we can observe the design and performance of AMD technology. In order not to go into details, we leave here a summary explaining what this technique consists of:

Production of power semiconductor chip packages fiber optic connection a. includes preparation Integrated photonic circuits Engraved V-groove in the fiber connection area at the front; Combination of organic redistribution photonic integrated circuits; etching biological redistribution organic redistribution layer; and attaching the optical fiber to the front side fiber splice region.

This is an AMD patent that applies to semiconductors.

In this document we see some diagrams with numbers and pieces, which after breaking down we get:

  • 100 – a package of semiconductor chips.
  • 105 – chip system (community,
  • 110 – photonic chip
  • 120 – connected fiber optic cable
  • 130 – Mold mixture
  • 135 – Single wafer substrate
  • 140 – biological redistribution layer (ORDL,
  • 145 – Micro-edges securing the SoC (105) and photonic chip (110) to the ORDL (140)
  • 150 – Perseverance
  • 155 – Bottom filling
  • 160 – array of ball grids (BGA) standard

Unfortunately, in order to apply this AMD technology, redistribution layers must be present between the chips ecological (ORDL). But the current one made of metalwho spreads acceso I/O same technology in different parts of the chip tsv about TSMCThis means we have biological technologies like screens OLED current use organic component Produce light when they respond to electrical stimulation.

However, it is unlikely that AMD will use this technology in the future. At least in the consumer sector, because everyday use costs too much. We will increasingly see it in high performance areas where its use is essential.

Godfrey Kemp

"Bacon fanatic. Social media enthusiast. Music practitioner. Internet scholar. Incurable travel advocate. Wannabe web junkie. Coffeeaholic. Alcohol fanatic."

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